Enming Song

Silicon Thin Film

Institute of Optoelectronics, Fudan University

220 Handan Road, Shanghai 200433, China

Email: sem@fudan.edu.cn

 

Biography

  Enming SONG currently works as Associate Professor in Institute of Optoelectronics at Fudan University. He was a postdoctoral fellow in Simpson Querrey Institute for Bioelectronics of Northwestern University from February, 2018 to October, 2020. During the most recent 5 years, he has published 15 scientific papers as first/co-first author (10 of them as first author), such as Nature Materials, Cell, Nature Biomedical Engineering, 3 papers of PNAS, Advanced Materials, ACS Nano, 2 papers of Advanced Functional Materials, etc. He also contributed 1 patent in USA in 2020. Based on his innovations on neural electronic interfaces, he has been just awarded by MIT Technology Review (Asia Pacific) as Innovators Under 35 in the year of 2021, and the Global Innovation Award awarded by United Nations Industrial Development Organization (UNIDO) in 2022.

Enming’s research interests refer to the fields of advance soft electronic materials for biomedical engineering, with a focus on developing flexible bioelectronic systems as chronic neural interfaces and of relevance semiconductor processing technologies. Compared to the most advanced innovation on brain-machine interfaces such as those of Neuralink Company, his work focuses on many thousands of active, flexible silicon-nanomembrane-transistor electrode array, with a central focus on neural signal amplification, high signal-to-noise ratio (~50 dB compared to ~10 dB of traditional electrodes) and the ability of multiplexed addressing. The innovation by him will open up future opportunities of new engineering design of neural interfaces for treatment of neurological disorder such as epilepsy.

 

Recent Selected Publications:

  1. E. Song, et al. Nat. Mater., 19, 590, 2020 (Highly-cited, ESI).
  2. E. Song, et al. Nat. Biomed. Eng., 5, 759, 2021.
  3. S. M. Won#, E. Song#, et al. Cell, 181, 115, 2020 (Co-first Author).
  4. E. Song, et al. Proc. Natl. Acad. Sci., 116, 15398, 2019.
  5. J. Li#, E. Song#, et al. Proc. Natl. Acad. Sci., 115, E9542, 2018 (Co-first Author, Journal’s Cover).

 

 

 

 

Abstract for Presentation

Flexible Neural Electronic Interfaces with Single-Crystalline Silicon-Nanomembrane Transistor Array

 

 

    Flexible engineered systems that establish high-performance, long-lived electrical interfaces to the brain, at a variety of scales ranging from individual-neuron resolution level to macroscopic area coverage, are of particular interest to the neuroscience and biomedical researches [1-4]. Conventional material approaches of state-of-art, fully-integrated electronic systems, such as deep brain stimulators, pacemakers and cochlear implants, generally feature stiff, thick (millimeter-scale) materials constructed by bulk metal, ceramics and wafers [5]. These resulting systems directly contact or insert into adjacent surface of bio-tissues by passive, rigid electrodes, where the materials used for these systems are fundamentally mismatched with the curved, compliant and time-dynamic tissues, with the potential of injury and associated foreign-body response that induces device degradation at biotic/electrode interfaces [6]. Here, our work reports a scalable approach with microscale transfer-printing technology to establish flexible bioelectronic systems that can integrate tens of thousands of single-crystalline silicon nanomembrane (Si-NM) transistors (100 nm thick) in interconnected arrays as functional neural interfaces on thin polymer substrates across full-scale brain dimension [4,7,8]. Specifically, the advanced technology has been exploited for deterministic assembly of prefabricated microelectronic devices sourced from semiconductor wafers, using patterned poly (dimethylsiloxane) (PDMS) stamps [7,9]. This scheme, as shown in Figures 1a and 1b, can support rapid, parallel transfer of large collections of variable types of devices (e.g. > 32,000 CMOS transistors and inorganic light emitted diodes) from rigid, planar silicon wafers to shape-conformal membranes as receiving surfaces, with various densities and pitch spacings across large areas (~150 cm2) on polymer films for neural electrophysiological mapping [7,10,11]. The scales of the demonstrated electronic neural interfaces yield significance of importance, with magnitudes of values that greatly surpass those from previous publications [12]. Furthermore, subsequent co-integration of these bioelectronic systems with thermally grown SiO2 at submicron thickness that serves as biofluid barriers can offer long-term stability, over projected lifetime across many decades of in-vivo implantation in human brain [6,10]. These results will create significant opportunities for flexible bio-integrated electronic systems as chronic neural implants in animal model studies and human healthcare.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig. 1. Photographs of a large collection of silicon nanomembrane transistors (total ~32,000) printed on a large polymer film

cut into the approximate outline of a human brain,while flat (a) and bent (b). Inset shows device yield as function of printing number.

 

 

Acknowledgement: This work is supported by Shanghai Municipal Science and Technology Major Project (No.2018SHZDZX01), ZJ Lab, and Shanghai Center for Brain Science and Brain-Inspired Technology.

 

 

 

References

[1] E. Song, et al., “Materials for flexible bioelectronic systems as chronic neural interfaces," Nat. Mater., 19 (2020) 590.

[2] E. Song, et al., “Miniaturized electromechanical devices for the characterization of the biomechanics of deep tissue." Nat. Biomed. Eng., 5, (2021) 759.

[3] S. M. Won#, E. Song#, J. Reeder# & J. A. Rogers*, “Emerging modalities and implantable technologies for neuromodulation," Cell, 181 (2020) 115 (Co-first Author).

[4] E. Song et al., “Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration,” Proc. Natl. Acad. Sci., 116 (2019) 15398.

[5] E. Song et al., “Ultrathin trilayer assemblies as long-lived barriers against water and ion penetration in flexible bioelectronic systems,” ACS Nano, 12 (2018) 10317.

[6] E. Song, J. Li & J. A. Rogers, “Barrier materials for flexible bioelectronic implants with chronic stability—current approaches and future directions,” APL Mater., 7 (2019) 050902.

[7] E. Song et al., “Thickness-dependent electronic transport in ultrathin single crystalline silicon nanomembranes," Adv. Electron. Mater., 5 (2019) 1900232.

[8] E. Song et al., “Schottky contact on ultra-thin silicon nanomembranes under light illumination,” Nanotechnology, 25 (2014) 485201.

[9] E. Song et al., “Bendable photodetector on fibers wrapped with flexible ultra-thin single crystalline silicon nanomembranes,” ACS Appl. Mater. Interfaces, 9 (2017) 12171.

[10] E. Song et al., “Transferred, ultrathin oxide bilayers as biofluid barriers for flexible electronic implants,” Adv. Funct. Mater., 28 (2018) 1702284.

[11] E. Song, et al., “Thin, transferred layers of silicon dioxide and silicon nitride as water and ion barriers for implantable flexible electronic systems." Adv. Electron. Mater., 3 (2017) 1700077.

[12] S. M. Won#, E. Song#, J. Zhao, J. Li, J. Rivnay & J.A. Rogers*, "Recent advances in materials, devices, and systems for neural interfaces," Adv. Mater., 30 (2018)1800534 (Co-first Author).